TREA

Hiroshi Onodera

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Workpiece cutting method
    • Patent number 9,633,887
    • Issue date Apr 25, 2017
    • Disco Corporation
    • Takashi Fukazawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of attaching wafer to sheet
    • Patent number 8,895,326
    • Issue date Nov 25, 2014
    • Disco Corporation
    • Kazuma Sekiya
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF ATTACHING WAFER TO SHEET
    • Publication number 20140134761
    • Publication date May 15, 2014
    • Disco Corporation
    • Kazuma Sekiya
    • H01 - BASIC ELECTRIC ELEMENTS