Hirotaka Ueda

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component used for wiring and method for manufacturing t...
- Patent number 8,399,980
- Issue date Mar 19, 2013
- Kyushu Institute of Technology
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package with post electrodes
- Patent number 8,110,911
- Issue date Feb 7, 2012
- Kyushu Institute of Technology
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device with electrode for ext...
- Patent number 8,017,452
- Issue date Sep 13, 2011
- Kyushu Institute of Technology
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet resin composition and process for manufacturing semiconductor...
- Patent number 6,884,695
- Issue date Apr 26, 2005
- Amkor Technology, Inc.
- Hirotaka Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet resin composition and process for manufacturing semiconductor...
- Patent number 6,620,862
- Issue date Sep 16, 2003
- Amkor Technology, Inc.
- Hirotaka Ueda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT USED FOR WIRING AND METHOD FOR MANUFACTURING T...
- Publication number 20110012269
- Publication date Jan 20, 2011
- KYUSHU INSTITUTE OF TECHNOLOGY
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20100295178
- Publication date Nov 25, 2010
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH ELECTRODE FOR EXT...
- Publication number 20090050994
- Publication date Feb 26, 2009
- KYUSHU INSTITUTE OF TECHNOLOGY
- Masamichi ISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sheet resin composition and process for manufacturing semiconductor...
- Publication number 20030207117
- Publication date Nov 6, 2003
- Hirotaka Ueda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Sheet resin composition and process for manufacturing semiconductor...
- Publication number 20020001688
- Publication date Jan 3, 2002
- Hirotaka Ueda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...