Hisakazu MARUTANI

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor package including laser proce...
- Patent number 10,529,635
- Issue date Jan 7, 2020
- J-Devices Corporation
- Hisakazu Marutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,786,110
- Issue date Jul 22, 2014
- J-Devices Corporation
- Hisakazu Marutani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20170316998
- Publication date Nov 2, 2017
- J-DEVICES CORPORATION
- Hisakazu MARUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120074594
- Publication date Mar 29, 2012
- J-DEVICES CORPORATION
- Hisakazu MARUTANI
- H01 - BASIC ELECTRIC ELEMENTS