Huan-Chun Fu

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Hsinchu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Stacked-type piezoelectric device and method for manufacturing the...
- Patent number 8,222,800
- Issue date Jul 17, 2012
- Industrial Technology Research Institute
- Wen-Chih Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding pad structure
- Patent number 6,236,114
- Issue date May 22, 2001
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-San Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF
- Publication number 20120133046
- Publication date May 31, 2012
- Industrial Technology Research Institute
- Chun-Hsien Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-TYPE PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20110006645
- Publication date Jan 13, 2011
- Industrial Technology Research Institute
- Wen-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS