Hwail Jin

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Cumming, GA, US

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Patents Applicationslast 30 patents

Information Patent Application
Low-Voiding Die Attach Film, Semiconductor Package, and Processes f...
- Publication number 20100279469
- Publication date Nov 4, 2010
- Hwail Jin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTI-LAYER ADHESIVE FILM FOR DIE STACKING
- Publication number 20090311520
- Publication date Dec 17, 2009
- Hwail Jin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...