Jack Chang Chien

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
System for separating a diced semiconductor die from a die attach tape
- Patent number 8,499,813
- Issue date Aug 6, 2013
- SanDisk Technologies Inc.
- Jack Chang Chien
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE
- Publication number 20120145332
- Publication date Jun 14, 2012
- Jack Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE
- Publication number 20110084377
- Publication date Apr 14, 2011
- Jack Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS