Jade Sharee LEWIS

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Phoenix, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
- Publication number 20250192059
- Publication date Jun 12, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN CORE LARGE AREA CAPACITORS
- Publication number 20240203664
- Publication date Jun 20, 2024
- Intel Corporation
- Yosef KORNBLUTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO TGV SUBSTRATES THROUGH DIRECT HYBRID BONDING OF T...
- Publication number 20240153857
- Publication date May 9, 2024
- Intel Corporation
- Bainye Francoise ANGOUA
- H01 - BASIC ELECTRIC ELEMENTS