Janine Kiyabu Kardokus

Person

Otis Orchards, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper-containing sputtering targets, and methods of forming copper...
- Patent number 6,858,102
- Issue date Feb 22, 2005
- Honeywell International Inc.
- Janine K. Kardokus
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Methods of forming copper-containing sputtering targets
- Patent number 6,849,139
- Issue date Feb 1, 2005
- Honeywell International Inc.
- Janine K. Kardokus
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper sputtering target assembly and method of making same
- Patent number 6,645,427
- Issue date Nov 11, 2003
- Honeywell International Inc.
- Janine K. Kardokus
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ni-plated target diffusion bonded to a backing plate and method of...
- Patent number 6,555,250
- Issue date Apr 29, 2003
- Honeywell International Inc.
- Ritesh P. Shah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Diffusion bonded sputtering target assembly with precipitation hard...
- Patent number 6,451,185
- Issue date Sep 17, 2002
- Honeywell International Inc.
- Anthony F. Beier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper sputtering target assembly and method of making same
- Patent number 6,331,234
- Issue date Dec 18, 2001
- Honeywell International Inc.
- Janine K. Kardokus
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Diffusion bonded sputtering target assembly with precipitation hard...
- Patent number 6,274,015
- Issue date Aug 14, 2001
- Honeywell International, Inc.
- Anthony F. Beier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper sputtering target assembly and method of making same
- Patent number 6,113,761
- Issue date Sep 5, 2000
- Johnson Matthey Electronics, Inc.
- Janine K. Kardokus
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hot pressed and sintered sputtering target assemblies and method fo...
- Patent number 5,863,398
- Issue date Jan 26, 1999
- Johnson Matthey Electonics, Inc.
- Janine K. Kardokus
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sputtering target with ultra-fine, oriented grains and method of ma...
- Patent number 5,809,393
- Issue date Sep 15, 1998
- Johnson Matthey Electronics, Inc.
- John Alden Dunlop
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Method of making high purity copper sputtering targets
- Patent number 5,803,342
- Issue date Sep 8, 1998
- Johnson Matthey Electronics, Inc.
- Janine K. Kardokus
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering target with ultra-fine, oriented grains and method of ma...
- Patent number 5,780,755
- Issue date Jul 14, 1998
- Johnson Matthey Electronics, Inc.
- John Alden Dunlop
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Sputtering target with ultra-fine, oriented grains and method of ma...
- Patent number 5,590,389
- Issue date Dec 31, 1996
- Johnson Matthey Electronics, Inc.
- John A. Dunlop
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

Patents Applicationslast 30 patents

Information Patent Application
Methods of forming copper-containing sputtering targets
- Publication number 20020112791
- Publication date Aug 22, 2002
- Janine K. Kardokus
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
NI-PLATED TARGET DIFFUSION BONDED TO A BACKING PLATE AND METHOD OF...
- Publication number 20020003010
- Publication date Jan 10, 2002
- RITESH P. SHAH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Diffusion bonded sputtering target assembly with precipitation hard...
- Publication number 20010048019
- Publication date Dec 6, 2001
- Anthony F. Beier
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Janine Kiyabu Kardokus

Person

Patents Grantslast 30 patents

Copper-containing sputtering targets, and methods of forming copper...

Methods of forming copper-containing sputtering targets

Copper sputtering target assembly and method of making same

Ni-plated target diffusion bonded to a backing plate and method of...

Diffusion bonded sputtering target assembly with precipitation hard...

Copper sputtering target assembly and method of making same

Diffusion bonded sputtering target assembly with precipitation hard...

Copper sputtering target assembly and method of making same

Hot pressed and sintered sputtering target assemblies and method fo...

Sputtering target with ultra-fine, oriented grains and method of ma...

Method of making high purity copper sputtering targets

Sputtering target with ultra-fine, oriented grains and method of ma...

Sputtering target with ultra-fine, oriented grains and method of ma...

Patents Applicationslast 30 patents

Methods of forming copper-containing sputtering targets

NI-PLATED TARGET DIFFUSION BONDED TO A BACKING PLATE AND METHOD OF...

Diffusion bonded sputtering target assembly with precipitation hard...