Jenn-Tarng Lin

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Diffusion barrier enhancement for sub-micron aluminum-silicon contacts
- Patent number 6,225,222
- Issue date May 1, 2001
- United Microelectronics Corporation
- Chi-Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier/glue layer on polysilicon layer
- Patent number 6,146,742
- Issue date Nov 14, 2000
- United Microelectronics Corp.
- Wen-Yi Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Container having ornament
- Patent number 6,098,794
- Issue date Aug 8, 2000
- Jenn-Shiun Lin
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Process for making contact plug
- Patent number 6,093,639
- Issue date Jul 25, 2000
- United Microelectronics Corp.
- Clint Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating metal plug
- Patent number 6,048,788
- Issue date Apr 11, 2000
- United Microelectronics Corp.
- Hung-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preventing overpolishing in a chemical-mechanical polishi...
- Patent number 6,030,892
- Issue date Feb 29, 2000
- United Microelectronics Corp.
- Kun-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a tungsten plug and a barrier layer in a contact...
- Patent number 5,990,004
- Issue date Nov 23, 1999
- United Microelectronics Corp.
- Yu-Ru Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a conductive plug
- Patent number 5,950,108
- Issue date Sep 7, 1999
- United Microelectronics Corp.
- Clint Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor components having a titanium...
- Patent number 5,897,373
- Issue date Apr 27, 1999
- United Microelectronics Corp.
- Yuan-Ching Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarization using interlayer dielectric
- Patent number 5,883,004
- Issue date Mar 16, 1999
- United Microelectronics Corp.
- Hao-Kuang Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of cleaning slurry remnants after the completion of a chemic...
- Patent number 5,876,508
- Issue date Mar 2, 1999
- United Microelectronics Corporation
- Kun-Lin Wu
- B08 - CLEANING
Information Patent Grant
Stress released VLSI structure by void formation
- Patent number 5,716,888
- Issue date Feb 10, 1998
- United Microelectronics Corporation
- Water Lur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked capacitor process using BPSG precipitates
- Patent number 5,466,627
- Issue date Nov 14, 1995
- United Microelectronics Corporation
- Water Lur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a convex charge coupled device
- Patent number 5,292,680
- Issue date Mar 8, 1994
- United Microelectronics Corporation
- Water Lur
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE METALLIZATION PROCESS FOR FILLING HIGH ASPECT RATIO CONTA...
- Publication number 20010045661
- Publication date Nov 29, 2001
- CHI-CHENG YANG
- H01 - BASIC ELECTRIC ELEMENTS

Jenn-Tarng Lin

Person

Patents Grantslast 30 patents

Diffusion barrier enhancement for sub-micron aluminum-silicon contacts

Barrier/glue layer on polysilicon layer

Container having ornament

Process for making contact plug

Method of fabricating metal plug

Method of preventing overpolishing in a chemical-mechanical polishi...

Method for forming a tungsten plug and a barrier layer in a contact...

Method of fabricating a conductive plug

Method of manufacturing semiconductor components having a titanium...

Method of planarization using interlayer dielectric

Method of cleaning slurry remnants after the completion of a chemic...

Stress released VLSI structure by void formation

Stacked capacitor process using BPSG precipitates

Method of forming a convex charge coupled device

Patents Applicationslast 30 patents

COMPOSITE METALLIZATION PROCESS FOR FILLING HIGH ASPECT RATIO CONTA...