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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,894,333
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Dahee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package-on-package devices including same
- Patent number 11,393,767
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Sunghawn Bae
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING STRUCTURE, METHOD OF MANUFACTURING THE WIRING STRUCTURE, AND...
- Publication number 20250140676
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Jeongrim SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038094
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Joongsun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220165698
- Publication date May 26, 2022
- Samsung Electronics Co., Ltd.
- Dahee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE DEVICES INCLUDING SAME
- Publication number 20210225773
- Publication date Jul 22, 2021
- Samsung Electronics Co., Ltd.
- SUNGHAWN BAE
- H01 - BASIC ELECTRIC ELEMENTS