Jeremias D. Romero

Person

Hayward, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of depositing copper using physical vapor deposition
- Patent number 9,728,414
- Issue date Aug 8, 2017
- Cypress Semiconductor Corporation
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing copper using physical vapor deposition
- Patent number 8,791,018
- Issue date Jul 29, 2014
- Spansion LLC
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using an adhesion precursor layer for chemical vapor depo...
- Patent number 7,169,706
- Issue date Jan 30, 2007
- Advanced Micro Devices, Inc.
- Sergey D. Lopatin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implanted barrier layer to improve line reliability and method of f...
- Patent number 6,992,004
- Issue date Jan 31, 2006
- Advanced Micro Devices, Inc.
- Paul R. Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining pore characteristics in porous materials
- Patent number 6,791,081
- Issue date Sep 14, 2004
- Advanced Micro Devices, Inc.
- Robert Matthew Ulfig
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming a metal or metal nitride interface layer between...
- Patent number 6,518,167
- Issue date Feb 11, 2003
- Advanced Micro Devices, Inc.
- Lu You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature sensing probe for microthermometry
- Patent number 5,713,667
- Issue date Feb 3, 1998
- Advanced Micro Devices, Inc.
- Roger Alvis
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of accurate compositional analysis of dielectric films on se...
- Patent number 5,707,484
- Issue date Jan 13, 1998
- Advaned Micro Devices, Inc.
- Jeremias D. Romero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TiW barrier metal process
- Patent number 5,290,588
- Issue date Mar 1, 1994
- Advanced Micro Devices, Incorporated
- Jeremias D. Romero
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DEPOSITING COPPER USING PHYSICAL VAPOR DEPOSITION
- Publication number 20140377949
- Publication date Dec 25, 2014
- Wen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING COPPER USING PHYSICAL VAPOR DEPOSITION
- Publication number 20140377948
- Publication date Dec 25, 2014
- Wen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of depositing copper using physical vapor deposition
- Publication number 20080146028
- Publication date Jun 19, 2008
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of using an adhesion precursor layer for chemical vapor depo...
- Publication number 20050085073
- Publication date Apr 21, 2005
- Advanced Micro Devices, Inc.
- Sergey D. Lopatin
- H01 - BASIC ELECTRIC ELEMENTS

Jeremias D. Romero

Person

Patents Grantslast 30 patents

Method of depositing copper using physical vapor deposition

Method of depositing copper using physical vapor deposition

Method of using an adhesion precursor layer for chemical vapor depo...

Implanted barrier layer to improve line reliability and method of f...

Method for determining pore characteristics in porous materials

Method of forming a metal or metal nitride interface layer between...

Temperature sensing probe for microthermometry

Method of accurate compositional analysis of dielectric films on se...

TiW barrier metal process

Patents Applicationslast 30 patents

METHOD OF DEPOSITING COPPER USING PHYSICAL VAPOR DEPOSITION

METHOD OF DEPOSITING COPPER USING PHYSICAL VAPOR DEPOSITION

Method of depositing copper using physical vapor deposition

Method of using an adhesion precursor layer for chemical vapor depo...