Jia-Wei Fang

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Adaptive thermal ceiling control system
- Patent number 11,989,005
- Issue date May 21, 2024
- Mediatek Inc.
- Bo-Jr Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 10,109,566
- Issue date Oct 23, 2018
- Mediatek Inc.
- Jia-Wei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter and ring oscillator with high temperature sensitivity
- Patent number 10,067,000
- Issue date Sep 4, 2018
- Mediatek Inc.
- Bo-Jr Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Methods for distributing power in layout of IC
- Patent number 9,904,752
- Issue date Feb 27, 2018
- Mediatek Inc.
- Zwei-Mei Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computer-implemented method of designing a modularized stacked inte...
- Patent number 9,904,751
- Issue date Feb 27, 2018
- Mediatek Inc.
- Jia-Wei Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 9,679,830
- Issue date Jun 13, 2017
- Mediatek Inc.
- Jia-Wei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with surface mounted passive element
- Patent number 9,660,017
- Issue date May 23, 2017
- Mediatek Inc.
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for co-designing flip-chip and interposer
- Patent number 9,589,092
- Issue date Mar 7, 2017
- Mediatek Inc.
- Jia-Wei Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for flip chip packaging co-design and co-desig...
- Patent number 9,552,452
- Issue date Jan 24, 2017
- Mediatek Inc.
- Jia-Wei Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensing circuit
- Patent number 9,490,808
- Issue date Nov 8, 2016
- Mediatek Inc.
- Bo-Jr Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Flip chip scheme and method of forming flip chip scheme
- Patent number 9,379,079
- Issue date Jun 28, 2016
- MediaTek Inc.
- Jia-Wei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for flip chip packaging co-design
- Patent number 9,305,131
- Issue date Apr 5, 2016
- MediaTek Inc.
- Jia-Wei Fang
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT CONFIGURABLE TO PERFORM ADAPTIVE THERMAL CEILING...
- Publication number 20230185280
- Publication date Jun 15, 2023
- MEDIATEK INC.
- Chih-Fu Tsai
- G05 - CONTROLLING REGULATING
Information Patent Application
ADAPTIVE THERMAL CEILING CONTROL SYSTEM
- Publication number 20220334558
- Publication date Oct 20, 2022
- MEDIATEK INC.
- Bo-Jr Huang
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170243814
- Publication date Aug 24, 2017
- MEDIATEK INC.
- Jia-Wei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20160343796
- Publication date Nov 24, 2016
- MEDIATEK INC.
- Bo-Jr HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DISTRIBUTING POWER IN LAYOUT OF IC
- Publication number 20160217243
- Publication date Jul 28, 2016
- MEDIATEK INC.
- Zwei-Mei LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR FLIP CHIP PACKAGING CO-DESIGN AND CO-DESIG...
- Publication number 20160217244
- Publication date Jul 28, 2016
- MEDIATEK INC.
- Jia-Wei Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC PACKAGE WITH SURFACE MOUNTED PASSIVE ELEMENT
- Publication number 20160211318
- Publication date Jul 21, 2016
- MEDIATEK INC.
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULARIZED STACKED IC PHYSICAL DESIGN FRAMEWORK
- Publication number 20160203253
- Publication date Jul 14, 2016
- MEDIATEK INC.
- Jia-Wei FANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20160197071
- Publication date Jul 7, 2016
- MEDIATEK INC.
- Chao-Yang YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SCHEME AND METHOD OF FORMING FLIP CHIP SCHEME
- Publication number 20160190083
- Publication date Jun 30, 2016
- MEDIATEK INC.
- Jia-Wei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTER AND RING OSCILLATOR WITH HIGH TEMPERATURE SENSITIVITY
- Publication number 20160153840
- Publication date Jun 2, 2016
- MEDIATEK INC.
- Bo-Jr HUANG
- G01 - MEASURING TESTING
Information Patent Application
SENSING CIRCUIT
- Publication number 20160156354
- Publication date Jun 2, 2016
- MEDIATEK INC.
- Bo-Jr HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160126161
- Publication date May 5, 2016
- MEDIATEK INC.
- Jia-Wei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FLIP CHIP PACKAGING CO-DESIGN
- Publication number 20150154336
- Publication date Jun 4, 2015
- MEDIATEK INC.
- Jia-Wei Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR CO-DESIGNING FLIP-CHIP AND INTERPOSER
- Publication number 20150154337
- Publication date Jun 4, 2015
- MEDIATEK INC.
- Jia-Wei FANG
- G06 - COMPUTING CALCULATING COUNTING

Jia-Wei Fang

Person

Patents Grantslast 30 patents

Adaptive thermal ceiling control system

Semiconductor package

Inverter and ring oscillator with high temperature sensitivity

Methods for distributing power in layout of IC

Computer-implemented method of designing a modularized stacked inte...

Semiconductor package

Microelectronic package with surface mounted passive element

Method for co-designing flip-chip and interposer

Method and apparatus for flip chip packaging co-design and co-desig...

Sensing circuit

Flip chip scheme and method of forming flip chip scheme

Method for flip chip packaging co-design

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT CONFIGURABLE TO PERFORM ADAPTIVE THERMAL CEILING...

ADAPTIVE THERMAL CEILING CONTROL SYSTEM

SEMICONDUCTOR PACKAGE

CAPACITOR STRUCTURE AND METHOD FOR FORMING THE SAME

METHODS FOR DISTRIBUTING POWER IN LAYOUT OF IC

METHOD AND APPARATUS FOR FLIP CHIP PACKAGING CO-DESIGN AND CO-DESIG...

MICROELECTRONIC PACKAGE WITH SURFACE MOUNTED PASSIVE ELEMENT

MODULARIZED STACKED IC PHYSICAL DESIGN FRAMEWORK

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FORMING THE SAME

FLIP CHIP SCHEME AND METHOD OF FORMING FLIP CHIP SCHEME

INVERTER AND RING OSCILLATOR WITH HIGH TEMPERATURE SENSITIVITY

SENSING CIRCUIT

SEMICONDUCTOR PACKAGE

METHOD FOR FLIP CHIP PACKAGING CO-DESIGN

METHOD FOR CO-DESIGNING FLIP-CHIP AND INTERPOSER