Jiann Sheng Chang

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Reducing substrate warpage in semiconductor processing
- Patent number 8,691,706
- Issue date Apr 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Automatic sensing wafer blade and method for using
- Patent number 6,896,304
- Issue date May 24, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiao-Yi Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Reducing Substrate Warpage in Semiconductor Processing
- Publication number 20130183831
- Publication date Jul 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Automatic sensing wafer blade and method for using
- Publication number 20040041421
- Publication date Mar 4, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS