Jimmy SIAT

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Copper on organic solderability preservative (OSP) interconnect and...
- Patent number 8,247,272
- Issue date Aug 21, 2012
- United Test & Assembly Center Ltd.
- Yong Chuan Koh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND...
- Publication number 20100025849
- Publication date Feb 4, 2010
- United Test & Assembly Center Ltd.
- Yong Chuan KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AVOIDING ELECTRICAL SHORTS IN PACKAGING
- Publication number 20090165815
- Publication date Jul 2, 2009
- United Test & Assembly Center Ltd.
- Debbie Tuerca ALCALA
- B08 - CLEANING
Information Patent Application
COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT
- Publication number 20090008796
- Publication date Jan 8, 2009
- United Test & Assembly Center Ltd.
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS