JISEOK HONG

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device having a bit line and a main insulating s...
- Patent number 11,908,797
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Jiyoung Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including underfill material layer and method...
- Patent number 11,764,192
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Jihwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stacked semiconductor chips
- Patent number 11,721,673
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having improved reliability in bonds between...
- Patent number 11,676,925
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-wafer bonding structure and semiconductor package using the...
- Patent number 11,658,141
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 11,647,627
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,557,596
- Issue date Jan 17, 2023
- Samsung Electronics Co., Ltd.
- Seoryong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including underfill material layer and method...
- Patent number 11,404,395
- Issue date Aug 2, 2022
- Samsung Electronics Co., Ltd.
- Jihwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-wafer bonding structure and semiconductor package using the...
- Patent number 11,289,438
- Issue date Mar 29, 2022
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a passivation spacer and method of f...
- Patent number 11,251,070
- Issue date Feb 15, 2022
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stacked semiconductor chips
- Patent number 11,244,927
- Issue date Feb 8, 2022
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having improved reliability in bonds between...
- Patent number 11,158,594
- Issue date Oct 26, 2021
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a passivation spacer and method of f...
- Patent number 10,790,186
- Issue date Sep 29, 2020
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,410,916
- Issue date Sep 10, 2019
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20230232616
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Jiseok HONG
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230225117
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Jiseok HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL MATERIAL LAYER AND METHOD...
- Publication number 20220344308
- Publication date Oct 27, 2022
- Samsung Electronics Co., Ltd.
- Jihwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-WAFER BONDING STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE...
- Publication number 20220181285
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220130801
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Hyuekjae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20220068863
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- JISEOK HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20220020758
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- SEORYONG PARK
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20210398569
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20210391259
- Publication date Dec 16, 2021
- Samsung Electronics Co., Ltd.
- Jiyoung Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL MATERIAL LAYER AND METHOD...
- Publication number 20210151410
- Publication date May 20, 2021
- Samsung Electronics Co., Ltd.
- Jihwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210143116
- Publication date May 13, 2021
- Samsung Electronics Co., Ltd.
- JISEOK HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-WAFER BONDING STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE...
- Publication number 20210104482
- Publication date Apr 8, 2021
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS
- Publication number 20210028152
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- Hyuekjae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PASSIVATION SPACER AND METHOD OF F...
- Publication number 20210005509
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- JISEOK HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190221475
- Publication date Jul 18, 2019
- Samsung Electronics Co., Ltd.
- Jiseok HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PASSIVATION SPACER AND METHOD OF F...
- Publication number 20190122919
- Publication date Apr 25, 2019
- Samsung Electronics Co., Ltd.
- JISEOK HONG
- H01 - BASIC ELECTRIC ELEMENTS

JISEOK HONG

Person

Patents Grantslast 30 patents

Integrated circuit device having a bit line and a main insulating s...

Semiconductor package including underfill material layer and method...

Semiconductor package having stacked semiconductor chips

Semiconductor packages having improved reliability in bonds between...

Die-to-wafer bonding structure and semiconductor package using the...

Integrated circuit device

Semiconductor memory device

Semiconductor package including underfill material layer and method...

Die-to-wafer bonding structure and semiconductor package using the...

Semiconductor device including a passivation spacer and method of f...

Semiconductor package having stacked semiconductor chips

Semiconductor packages having improved reliability in bonds between...

Semiconductor device including a passivation spacer and method of f...

Semiconductor device

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL MATERIAL LAYER AND METHOD...

DIE-TO-WAFER BONDING STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE...

SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR MEMORY DEVICE

INTEGRATED CIRCUIT DEVICE

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL MATERIAL LAYER AND METHOD...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

DIE-TO-WAFER BONDING STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE...

SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE INCLUDING A PASSIVATION SPACER AND METHOD OF F...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING A PASSIVATION SPACER AND METHOD OF F...