John M. Beall

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Richardson, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Top-side cooling of RF products in air cavity composite packages
- Patent number 9,899,292
- Issue date Feb 20, 2018
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses, systems, and methods for die attach coatings for semic...
- Patent number 9,659,898
- Issue date May 23, 2017
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air cavity package including a package lid having at least one prot...
- Patent number 8,564,968
- Issue date Oct 22, 2013
- TriQuint Semiconductor, Inc.
- Youngwook Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bumps for die alignment
- Patent number 7,880,287
- Issue date Feb 1, 2011
- TriQuint Semiconductor, Inc.
- Bruno Samuel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TOP-SIDE COOLING OF RF PRODUCTS IN AIR CAVITY COMPOSITE PACKAGES
- Publication number 20170229368
- Publication date Aug 10, 2017
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS