Jun-young RYU

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method for polishing a semiconductor wafer
- Patent number 7,223,158
- Issue date May 29, 2007
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing a semiconductor wafer
- Patent number 7,081,045
- Issue date Jul 25, 2006
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head of chemical mechanical polishing apparatus and polis...
- Patent number 6,945,861
- Issue date Sep 20, 2005
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing a semiconductor wafer and method therefor
- Patent number 6,921,323
- Issue date Jul 26, 2005
- Samsung Electronics, Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head of chemical mechanical polishing apparatus and polis...
- Patent number 6,881,135
- Issue date Apr 19, 2005
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing station of a chemical mechanical polishing apparatus
- Patent number 6,840,846
- Issue date Jan 11, 2005
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head of chemical mechanical polishing apparatus and polis...
- Patent number 6,769,973
- Issue date Aug 3, 2004
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing a semiconductor wafer and method therefor
- Patent number 6,652,362
- Issue date Nov 25, 2003
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Complementing circuit for tilt of picture in a display device
- Patent number 5,953,081
- Issue date Sep 14, 1999
- Samsung Electronics Co., Ltd.
- Jun-Young Ryu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY APPARATUS, CONTROL METHOD THEREOF, AND INPUT APPARATUS USED...
- Publication number 20130169763
- Publication date Jul 4, 2013
- Samsung Electronics Co., Ltd.
- Hoon CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR WAFER
- Publication number 20070232209
- Publication date Oct 4, 2007
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus and methods for polishing a semiconductor wafer
- Publication number 20060116056
- Publication date Jun 1, 2006
- Samsung Electronics, Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD OF CHEMICAL MECHANICAL POLISHING APPARATUS AND POLIS...
- Publication number 20050153635
- Publication date Jul 14, 2005
- Samsung Electronics, Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus for polishing a semiconductor wafer and method therefor
- Publication number 20050136806
- Publication date Jun 23, 2005
- Samsung Electronics, Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Polishing head of chemical mechanical polishing apparatus and polis...
- Publication number 20040242129
- Publication date Dec 2, 2004
- SAMSUNG ELECTRONICS CO., LTD.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus for polishing a semiconductor wafer and method therefor
- Publication number 20040072517
- Publication date Apr 15, 2004
- SAMSUNG ELECTRONICS CO., LTD.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Polishing station of a chemical mechanical polishing apparatus
- Publication number 20030236056
- Publication date Dec 25, 2003
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Polishing head of chemical mechanical polishing apparatus and polis...
- Publication number 20030008604
- Publication date Jan 9, 2003
- SAMSUNG ELECTRONICS CO., LTD.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus for polishing a semiconductor wafer and method therefor
- Publication number 20020098780
- Publication date Jul 25, 2002
- SAMSUNG ELECTRONICS CO., LTD.
- Jae-Phil Boo
- B24 - GRINDING POLISHING

Jun-young RYU

Person

Patents Grantslast 30 patents

Method for polishing a semiconductor wafer

Apparatus for polishing a semiconductor wafer

Polishing head of chemical mechanical polishing apparatus and polis...

Apparatus for polishing a semiconductor wafer and method therefor

Polishing head of chemical mechanical polishing apparatus and polis...

Polishing station of a chemical mechanical polishing apparatus

Polishing head of chemical mechanical polishing apparatus and polis...

Apparatus for polishing a semiconductor wafer and method therefor

Complementing circuit for tilt of picture in a display device

Patents Applicationslast 30 patents

DISPLAY APPARATUS, CONTROL METHOD THEREOF, AND INPUT APPARATUS USED...

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

Apparatus and methods for polishing a semiconductor wafer

POLISHING HEAD OF CHEMICAL MECHANICAL POLISHING APPARATUS AND POLIS...

Apparatus for polishing a semiconductor wafer and method therefor

Polishing head of chemical mechanical polishing apparatus and polis...

Apparatus for polishing a semiconductor wafer and method therefor

Polishing station of a chemical mechanical polishing apparatus

Polishing head of chemical mechanical polishing apparatus and polis...

Apparatus for polishing a semiconductor wafer and method therefor