Kangsan Lee

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Hwaseong-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus including bonding head
- Patent number 12,136,563
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Mingu Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR STACKING CHIP
- Publication number 20250226354
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Ahra JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING BONDING HEAD
- Publication number 20220102185
- Publication date Mar 31, 2022
- Samsung Electronics Co., Ltd.
- Mingu Lee
- H01 - BASIC ELECTRIC ELEMENTS