Kanji Sato

Follow

Person

Saitama, JP

People

Patents Applicationslast 30 patents

Information Patent Application
Mold for Wiring Substrate Formation and Process for Producing the S...
- Publication number 20090314525
- Publication date Dec 24, 2009
- Mitsui Mining and Smelting Co., Ltd.
- Hitoshi Kajino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR