Katsuo Yoshizawa

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Kosyoku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing SOI wafer including heat treatment in an o...
- Patent number 6,534,384
- Issue date Mar 18, 2003
- Shin-Etsu Handotai Co., Ltd.
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a bonding substrate
- Patent number 5,918,139
- Issue date Jun 29, 1999
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for production of SOI substrate
- Patent number 5,650,353
- Issue date Jul 22, 1997
- Shin-Etsu Handotai Co., Ltd.
- Katsuo Yoshizawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR MANUFACTURING SOI WAFER AND SOI WAFER
- Publication number 20010055863
- Publication date Dec 27, 2001
- MASATAKE NAKANO
- H01 - BASIC ELECTRIC ELEMENTS