Kazuhiro Shinozaki

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Component built-in wiring board and manufacturing method of compone...
- Patent number 7,644,497
- Issue date Jan 12, 2010
- Dai Nippon Printing Co., Ltd.
- Tatsuro Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in wiring board and manufacturing method of compone...
- Patent number 7,345,888
- Issue date Mar 18, 2008
- Dai Nippon Printing Co., Ltd.
- Tatsuro Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board incorporating components and process for producing the...
- Patent number 7,242,591
- Issue date Jul 10, 2007
- Dai Nippon Printing Co., Ltd.
- Tatsuro Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20240404928
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20240145356
- Publication date May 2, 2024
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20240030114
- Publication date Jan 25, 2024
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component built-in wiring board and manufacturing method of compone...
- Publication number 20080163486
- Publication date Jul 10, 2008
- DAI NIPPON PRINTING CO., LTD.
- Tatsuro Imamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Component built-in wiring board and manufacturing method of compone...
- Publication number 20070195511
- Publication date Aug 23, 2007
- DAI NIPPON PRINTING CO., LTD.
- Tatsuro Imamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring board incorporating components and process for producing the...
- Publication number 20060154496
- Publication date Jul 13, 2006
- Tatsuro Imamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Kazuhiro Shinozaki

Person

Patents Grantslast 30 patents

Component built-in wiring board and manufacturing method of compone...

Component built-in wiring board and manufacturing method of compone...

Wiring board incorporating components and process for producing the...

Patents Applicationslast 30 patents

LEAD FRAME AND MANUFACTURING METHOD THEREOF

LEAD FRAME AND MANUFACTURING METHOD THEREOF

LEAD FRAME AND MANUFACTURING METHOD THEREOF

Component built-in wiring board and manufacturing method of compone...

Component built-in wiring board and manufacturing method of compone...

Wiring board incorporating components and process for producing the...