Kelvin Tan Aik Boo

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George Town, MY

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit wire bonded to a multi-layer substrate having an...
- Patent number 11,929,351
- Issue date Mar 12, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount device bonded to an inner layer of a multi-layer subs...
- Patent number 11,723,150
- Issue date Aug 8, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit wire bonded to a multi-layer substrate having an...
- Patent number 11,282,811
- Issue date Mar 22, 2022
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC DEVICE PACKAGES AND RELATED METHODS AND SYSTEMS
- Publication number 20240079306
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT DEVICE BONDED TO AN INNER LAYER OF A MULTI-LAYER SUBS...
- Publication number 20230345639
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WIRE BONDED TO A MULTI-LAYER SUBSTRATE HAVING AN...
- Publication number 20220181307
- Publication date Jun 9, 2022
- Micron Technology, Inc.
- Kelvin Tam Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT DEVICE BONDED TO AN INNER LAYER OF A MULTI-LAYER SUBS...
- Publication number 20220078915
- Publication date Mar 10, 2022
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WIRE BONDED TO A MULTI-LAYER SUBSTRATE HAVING AN...
- Publication number 20210358888
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS