Kenichi Kaneda

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Tochigi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board fabrication method, printed wiring board, mult...
- Patent number 8,754,337
- Issue date Jun 17, 2014
- Sumitomo Bakelite Co., Ltd.
- Kenichi Kaneda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated body, method of manufacturing substrate, substrate, and s...
- Patent number 8,455,765
- Issue date Jun 4, 2013
- Sumitomo Bakelite Company, Ltd.
- Junpei Morimoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device package having a low profile structure and hig...
- Patent number 5,302,852
- Issue date Apr 12, 1994
- NEC Corporation
- Kenichi Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass-sealed semiconductor device
- Patent number 5,087,963
- Issue date Feb 11, 1992
- NEC Corporation
- Kenichi Kaneda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD FABRICATION METHOD, PRINTED WIRING BOARD, MULT...
- Publication number 20120037413
- Publication date Feb 16, 2012
- Kenichi Kaneda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION FOR WIRING BOARD, RESIN SHEET FOR WIRING BOARD, C...
- Publication number 20110308848
- Publication date Dec 22, 2011
- Sumitomo Bakelite Company, Ltd.
- Yuka Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR LAMINATING PREPREG, METHOD FOR PRODUCING PRINTED WIRING...
- Publication number 20110180208
- Publication date Jul 28, 2011
- Kenya TACHIBANA
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATED BODY, METHOD OF MANUFACTURING SUSBTRATE, SUBSTRATE, AND S...
- Publication number 20100044081
- Publication date Feb 25, 2010
- SUMITOMO BAKELITE COMPANY LIMITED
- Junpei Morimoto
- B32 - LAYERED PRODUCTS