Kenneth A. Cupples

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Pawcatuck, CT, US

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Patents Grantslast 30 patents

Information Patent Grant
Cable assembly dispenser systems and associated methods
- Patent number 10,322,868
- Issue date Jun 18, 2019
- Ortronics, Inc.
- Kenneth A. Cupples
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Cable assemblies and associated systems and methods
- Patent number 9,601,880
- Issue date Mar 21, 2017
- Ortronics, Inc.
- Chester H. Rynaski
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
High density jack
- Patent number 8,672,709
- Issue date Mar 18, 2014
- Ortronics, Inc.
- William H. Dietz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High density jack
- Patent number 8,628,351
- Issue date Jan 14, 2014
- Ortronics, Inc.
- William H. Dietz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High density jack
- Patent number 8,439,702
- Issue date May 14, 2013
- Ortronics, Inc.
- William H. Dietz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Cable Assemblies and Associated Systems and Methods
- Publication number 20150280363
- Publication date Oct 1, 2015
- Ortronics, Inc.
- Chester H. Rynaski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cable Assembly Dispenser Systems and Associated Methods
- Publication number 20140263814
- Publication date Sep 18, 2014
- Ortronics, Inc.
- Kenneth A. Cupples
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
High Density Jack
- Publication number 20130244479
- Publication date Sep 19, 2013
- Ortronics, Inc.
- William H. Dietz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cable Assemblies, Methods and Systems
- Publication number 20130210264
- Publication date Aug 15, 2013
- Ortronics, Inc.
- Chester H. Rynaski
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
High Density Jack
- Publication number 20120171888
- Publication date Jul 5, 2012
- Ortronics, Inc.
- William H. Dietz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density Jack
- Publication number 20120077375
- Publication date Mar 29, 2012
- Ortronics, Inc.
- William H. Dietz
- H01 - BASIC ELECTRIC ELEMENTS