Ki-Bum Kim

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Seongnam-shi, KR

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Patents Grantslast 30 patents

Information Patent Grant
Copper interconnect structure having stuffed diffusion barrier
- Patent number 7,732,331
- Issue date Jun 8, 2010
- ASM International N.V.
- Ki-Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure having stuffed diffusion barrier
- Patent number 6,936,535
- Issue date Aug 30, 2005
- ASM International N.V
- Ki-Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Copper interconnect structure having stuffed diffusion barrier
- Publication number 20050101132
- Publication date May 12, 2005
- Ki-Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect structure having stuffed diffusion barrier
- Publication number 20020187631
- Publication date Dec 12, 2002
- Ki-Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS