Ki-Chul Park

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Fishkill, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods for forming damascene wiring structures having line and plu...
- Patent number 7,514,354
- Issue date Apr 7, 2009
- Samsung Electronics Co., Ltd.
- Ki-Chul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming dual-damascene interconnect structures on semico...
- Patent number 7,365,025
- Issue date Apr 29, 2008
- Samsung Electronics Co., Ltd.
- Kyoung-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of forming dual-damascene interconnect structures on semico...
- Publication number 20070184649
- Publication date Aug 9, 2007
- Kyoung-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for forming damascene wiring structures having line and plu...
- Publication number 20070155165
- Publication date Jul 5, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Ki-Chul Park
- H01 - BASIC ELECTRIC ELEMENTS