Kiminori ISHIDO

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 10,256,196
- Issue date Apr 9, 2019
- J-Devices Corporation
- Kiminori Ishido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,685,376
- Issue date Jun 20, 2017
- J-Devices Corporation
- Yoshihiko Ikemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,635,762
- Issue date Apr 25, 2017
- J-DEVICES CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic shielding package of non-volatile magnetic memory element
- Patent number 9,553,052
- Issue date Jan 24, 2017
- J-Devices Corporation
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 9,368,474
- Issue date Jun 14, 2016
- J-DEVICES CORPORATION
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink in the aperture of substrate
- Patent number 9,362,200
- Issue date Jun 7, 2016
- J-DEVICES CORPORATION
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect substrate, method of manufacturing interconnect substr...
- Patent number 8,367,939
- Issue date Feb 5, 2013
- Renesas Electronics Corporation
- Kiminori Ishido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,174,117
- Issue date May 8, 2012
- Renesas Electronics Corporation
- Kiminori Ishido
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170005044
- Publication date Jan 5, 2017
- J-DEVICES CORPORATION
- Kiminori ISHIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC SHIELDING PACKAGE OF NON-VOLATILE MAGNETIC MEMORY ELEMENT
- Publication number 20160172580
- Publication date Jun 16, 2016
- J-DEVICES CORPORATION
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20160079204
- Publication date Mar 17, 2016
- J-DEVICES CORPORATION
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160027715
- Publication date Jan 28, 2016
- J-DEVICES CORPORATION
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160027695
- Publication date Jan 28, 2016
- J-DEVICES CORPORATION
- Yoshihiko IKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150371934
- Publication date Dec 24, 2015
- J-DEVICES CORPORATION
- Hirokazu HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device, and semiconductor device
- Publication number 20100140796
- Publication date Jun 10, 2010
- NEC Electronics Corporation
- Kiminori Ishido
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Interconnect substrate, method of manufacturing interconnect substr...
- Publication number 20100139963
- Publication date Jun 10, 2010
- NEC Electronics Corporation
- Kiminori Ishido
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090096095
- Publication date Apr 16, 2009
- NEC Electronics Corporation
- Kiminori Ishido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed wiring board having plural solder resist layers and method...
- Publication number 20080135279
- Publication date Jun 12, 2008
- NEC Electronics Corporation
- Kiminori Ishido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20030193094
- Publication date Oct 16, 2003
- NEC Electronics Corporation
- Nobuaki Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kiminori ISHIDO

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing same

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package

Magnetic shielding package of non-volatile magnetic memory element

Manufacturing method for semiconductor device

Heat sink in the aperture of substrate

Interconnect substrate, method of manufacturing interconnect substr...

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

MAGNETIC SHIELDING PACKAGE OF NON-VOLATILE MAGNETIC MEMORY ELEMENT

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Manufacturing method of semiconductor device, and semiconductor device

Interconnect substrate, method of manufacturing interconnect substr...

Semiconductor device and method of manufacturing the same

Printed wiring board having plural solder resist layers and method...

Semiconductor device and method for fabricating the same