Koichiro NIWA

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Heat sink in the aperture of substrate
- Patent number 9,362,200
- Issue date Jun 7, 2016
- J-DEVICES CORPORATION
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150371934
- Publication date Dec 24, 2015
- J-DEVICES CORPORATION
- Hirokazu HONDA
- H01 - BASIC ELECTRIC ELEMENTS