KUEN-CHIH LAN

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NEW TAIPEI CITY, TW

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Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE
- Publication number 20250018486
- Publication date Jan 16, 2025
- COMPTAKE TECHNOLOGY INC.
- YAO-GUANG YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD OF PROCESSING ALUMINUM ALLOY
- Publication number 20250018517
- Publication date Jan 16, 2025
- COMPTAKE TECHNOLOGY INC.
- YAO-GUANG YANG
- B24 - GRINDING POLISHING