KWANGWUK PARK

Person

SUWON-SI, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip including buried dielectric pattern at edge regi...
- Patent number 11,848,285
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Kwangwuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including via structures with undercut portion...
- Patent number 11,798,866
- Issue date Oct 24, 2023
- Samsung Electronics Co, Ltd.
- Eunji Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,791,242
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Kwangwuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via (TSV) key for overlay measurement, and semicond...
- Patent number 11,749,614
- Issue date Sep 5, 2023
- Samsung Electronics Co., Ltd.
- Yongyeop Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via electrode and device isolation structure including oxid...
- Patent number 11,735,498
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Kwangwuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including via structure with head and body por...
- Patent number 11,380,606
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Eunji Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACT...
- Publication number 20230178434
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Minyoung KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING BURIED DIELECTRIC PATTERN AT EDGE REGI...
- Publication number 20230044131
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Kwangwuk PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20220336327
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- EUNJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA (TSV) KEY FOR OVERLAY MEASUREMENT, AND SEMICOND...
- Publication number 20220139840
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Yongyeop KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220139806
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Kwangwuk PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220020667
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Kwangwuk PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20210020545
- Publication date Jan 21, 2021
- Samsung Electronics Co., Ltd.
- EUNJI KIM
- H01 - BASIC ELECTRIC ELEMENTS

KWANGWUK PARK

Person

Patents Grantslast 30 patents

Semiconductor chip including buried dielectric pattern at edge regi...

Semiconductor device including via structures with undercut portion...

Semiconductor device

Through-silicon via (TSV) key for overlay measurement, and semicond...

Through via electrode and device isolation structure including oxid...

Semiconductor device including via structure with head and body por...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACT...

SEMICONDUCTOR CHIP INCLUDING BURIED DIELECTRIC PATTERN AT EDGE REGI...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

THROUGH-SILICON VIA (TSV) KEY FOR OVERLAY MEASUREMENT, AND SEMICOND...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE