Lau Kee Kwang

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Singapore, SG

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20120153465
- Publication date Jun 21, 2012
- Jimmy Hwee-Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip package using no-flow underfill and method of fabrication
- Publication number 20050087883
- Publication date Apr 28, 2005
- Advanpack Solutions Pte. Ltd.
- Tan Kim Hwee
- H01 - BASIC ELECTRIC ELEMENTS