Laure Elisa Carbonell

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Montlhery, FR

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Patents Grantslast 30 patents

Information Patent Grant
Formation of deep via airgaps for three dimensional wafer to wafer...
- Patent number 7,338,896
- Issue date Mar 4, 2008
- Interuniversitair Microelektronica Centrum (IMEC)
- Serge Vanhaelemeersch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Formation of deep via airgaps for three dimensional wafer to wafer...
- Publication number 20060223301
- Publication date Oct 5, 2006
- Serge Vanhaelemeersch
- H01 - BASIC ELECTRIC ELEMENTS