Liang-Yi Hung

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a packaging substrate including a carrier hav...
- Patent number 10,096,491
- Issue date Oct 9, 2018
- Silicon Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a thermal conductor made of silver between...
- Patent number 9,607,923
- Issue date Mar 28, 2017
- Siliconware Precision Industries Co., Ltd.
- Chung-Jen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,542,598
- Issue date Jan 10, 2017
- Siliconware Precision Industries Co., Ltd.
- Wen-Yu Teng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 9,112,063
- Issue date Aug 18, 2015
- Siliconware Precision Industries Co., Ltd.
- Wei Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,796,867
- Issue date Aug 5, 2014
- Siliconware Precision Industries Co., Ltd.
- Wei Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,471,383
- Issue date Jun 25, 2013
- Siliconware Precision Industries Co., Ltd.
- Liang-Yi Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20240363577
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321672
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Cheng-Lun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and fabrication method thereof
- Publication number 20160329261
- Publication date Nov 10, 2016
- Siliconware Precision Industries Co., Ltd.
- Chung-Jen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160172264
- Publication date Jun 16, 2016
- Siliconware Precision Industries Co., Ltd.
- Wen-Yu Teng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FABRICATING A PACKAGING SUBSTRATE
- Publication number 20150303073
- Publication date Oct 22, 2015
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGING STRUCTURE
- Publication number 20150179598
- Publication date Jun 25, 2015
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150102484
- Publication date Apr 16, 2015
- Siliconware Precision Industries Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20150028485
- Publication date Jan 29, 2015
- Siliconware Precision Industries Co., Ltd.
- Liang-Yi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20140308780
- Publication date Oct 16, 2014
- Wei Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A PACKAGING SUBSTRATE
- Publication number 20140057410
- Publication date Feb 27, 2014
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130307152
- Publication date Nov 21, 2013
- Wei Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20130228921
- Publication date Sep 5, 2013
- Siliconware Precision Industries Co., Ltd.
- Liang-Yi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130026657
- Publication date Jan 31, 2013
- Siliconware Precision Industries Co., Ltd.
- Wei-Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120326305
- Publication date Dec 27, 2012
- Siliconware Precision Industries Co., Ltd.
- Liang-Yi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipating semiconductor package
- Publication number 20080164604
- Publication date Jul 10, 2008
- Siliconware Precision Industries Co., Ltd.
- Liang-Yi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipating chip structure and fabrication method thereof and...
- Publication number 20080150128
- Publication date Jun 26, 2008
- Siliconware Precision Industries Co., Ltd.
- Liang-Yi Hung
- H01 - BASIC ELECTRIC ELEMENTS

Liang-Yi Hung

Person

Patents Grantslast 30 patents

Method of fabricating a packaging substrate including a carrier hav...

Electronic device having a thermal conductor made of silver between...

Package structure and fabrication method thereof

Fabrication method of semiconductor package

Semiconductor package and fabrication method thereof

Semiconductor package and fabrication method thereof

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Electronic device and fabrication method thereof

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

METHOD OF FABRICATING A PACKAGING SUBSTRATE

FLIP-CHIP PACKAGING STRUCTURE

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

METHOD OF FABRICATING A PACKAGING SUBSTRATE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Heat dissipating semiconductor package

Heat dissipating chip structure and fabrication method thereof and...