Membership
Tour
Register
Log in
Marcel Wieland
Follow
Person
Radebeul, DE
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit structure with dielectric material to cover hori...
Patent number
11,557,421
Issue date
Jan 17, 2023
GLOBALFOUNDRIES Dresden Module One Limited Liability Company & Co. KG
Frank G. Küchenmeister
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods, apparatus, and system for high-bandwidth on-mold antennas
Patent number
10,594,356
Issue date
Mar 17, 2020
GLOBALFOUNDRIES Inc.
Saquib Bin Halim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level packaging with integrated antenna structures
Patent number
10,580,745
Issue date
Mar 3, 2020
GLOBALFOUNDRIES Inc.
Marcel Wieland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods, apparatus, and system for high-bandwidth on-mold antennas
Patent number
10,411,752
Issue date
Sep 10, 2019
GLOBALFOUNDRIES Inc.
Saquib Bin Halim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with improved metal pillar configuration
Patent number
9,136,234
Issue date
Sep 15, 2015
GLOBALFOUNDRIES Inc.
Matthias Lehr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Efficient method of forming and assembling a microelectronic chip i...
Patent number
7,491,556
Issue date
Feb 17, 2009
Advanced Micro Devices, Inc.
Gotthard Jungnickel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor substrate thinning method for manufacturing thinned die
Patent number
7,375,032
Issue date
May 20, 2008
Advanced Micro Devices, Inc.
Frank Seliger
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH DIELECTRIC MATERIAL TO COVER HORI...
Publication number
20210280352
Publication date
Sep 9, 2021
GLOBALFOUNDRIES Dresden Module One Limited Liability Company & Co. KG
Frank G. Küchenmeister
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGING WITH INTEGRATED ANTENNA STRUCTURES
Publication number
20200075513
Publication date
Mar 5, 2020
GLOBALFOUNDRIES INC.
Marcel Wieland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED METAL PILLAR CONFIGURATION
Publication number
20150014843
Publication date
Jan 15, 2015
GLOBALFOUNDRIES INC.
Matthias Lehr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER
Publication number
20080099913
Publication date
May 1, 2008
Matthias Lehr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Efficient method of forming and assembling a microelectronic chip i...
Publication number
20060172444
Publication date
Aug 3, 2006
Gotthard Jungnickel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor substrate thinning method for manufacturing thinned die
Publication number
20060068595
Publication date
Mar 30, 2006
Frank Seliger
H01 - BASIC ELECTRIC ELEMENTS