Mark Dydyk

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Cave Creek, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer backside grinding with stress relief
- Patent number 8,222,118
- Issue date Jul 17, 2012
- Intel Corporation
- Mark Dydyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cutting methods and packages using dice derived therefrom
- Patent number 7,795,116
- Issue date Sep 14, 2010
- Intel Corporation
- Mark Dydyk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wafer Backside Grinding with Stress Relief
- Publication number 20100151678
- Publication date Jun 17, 2010
- Mark Dydyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer cutting methods and packages using dice derived therefrom
- Publication number 20100078768
- Publication date Apr 1, 2010
- Mark Dydyk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR