Mary Anne Manumpil

Person

Northridge, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High etch selectivity, low stress ashable carbon hard mask
- Patent number 12,062,537
- Issue date Aug 13, 2024
- Lam Research Corporation
- Jun Xue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Underlayer for photoresist adhesion and dose reduction
- Patent number 11,988,965
- Issue date May 21, 2024
- Lam Research Corporation
- Samantha S. H. Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Underlayer for photoresist adhesion and dose reduction
- Patent number 11,314,168
- Issue date Apr 26, 2022
- Lam Research Corporation
- Samantha S. H. Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK
- Publication number 20240395542
- Publication date Nov 28, 2024
- LAM RESEARCH CORPORATION
- Jun XUE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION
- Publication number 20240255850
- Publication date Aug 1, 2024
- LAM RESEARCH CORPORATION
- Samantha S.H. Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE MODIFICATION FOR METAL-CONTAINING PHOTORESIST DEPOSITION
- Publication number 20230230811
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY, MODULUS, AND HARDNESS AMORPHOUS CARBON FILMS AT LOW P...
- Publication number 20220282366
- Publication date Sep 8, 2022
- LAM RESEARCH CORPORATION
- Matthew Scott Weimer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK
- Publication number 20220181147
- Publication date Jun 9, 2022
- Jun XUE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION
- Publication number 20220043334
- Publication date Feb 10, 2022
- LAM RESEARCH CORPORATION
- Samantha S.H. Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION
- Publication number 20220035247
- Publication date Feb 3, 2022
- LAM RESEARCH CORPORATION
- Samantha S.H. Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Mary Anne Manumpil

Person

Patents Grantslast 30 patents

High etch selectivity, low stress ashable carbon hard mask

Underlayer for photoresist adhesion and dose reduction

Underlayer for photoresist adhesion and dose reduction

Patents Applicationslast 30 patents

HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK

UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION

SURFACE MODIFICATION FOR METAL-CONTAINING PHOTORESIST DEPOSITION

HIGH DENSITY, MODULUS, AND HARDNESS AMORPHOUS CARBON FILMS AT LOW P...

HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK

UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION

UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION