Masaaki Ishiyama

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Functional alloy plating using substitute bonding material for Pb a...
- Patent number 6,875,332
- Issue date Apr 5, 2005
- Nishihara Rikoh Corporation
- Masaaki Ishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional alloy plating using substitute bonding material for Pb a...
- Patent number 6,790,333
- Issue date Sep 14, 2004
- Nishihara Rikoh Corporation
- Masaaki Ishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional Sn-Bi alloy plating using a substitute material for Pb
- Patent number 6,478,944
- Issue date Nov 12, 2002
- Nishihara Rikoh Corporation
- Masaaki Ishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aqueous dispersion of an aqueous hydrazine-terminated polyurethane
- Patent number 5,700,867
- Issue date Dec 23, 1997
- Toyo Ink Manufacturing Co., Ltd.
- Masaaki Ishiyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Functional alloy plating using substitute bonding material for Pb a...
- Publication number 20030168341
- Publication date Sep 11, 2003
- Nishihara Rikoh Corporation
- Masaaki Ishiyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Functional alloy plating using substitute bonding material for Pb a...
- Publication number 20030141192
- Publication date Jul 31, 2003
- Nishihara Rikoh Corporation
- Masaaki Ishiyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR