Masahiko Hyugaji

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip semiconductor devise having an electrode pad covered with...
- Patent number 5,506,451
- Issue date Apr 9, 1996
- Kabushiki Kaisha Toshiba
- Masahiko Hyugaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having layered electrode
- Patent number 5,412,249
- Issue date May 2, 1995
- Kabushiki Kaisha Toshiba
- Masahiko Hyugaji
- H01 - BASIC ELECTRIC ELEMENTS