Masahiko KISHIMOTO

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate holding apparatus, elastic membrane, polishing apparatus,...
- Patent number 11,179,823
- Issue date Nov 23, 2021
- Ebara Corporation
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Grant
Elastic membrane for semiconductor wafer polishing
- Patent number D913977
- Issue date Mar 23, 2021
- Ebara Corporation
- Satoru Yamaki
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Elastic membrane for semiconductor wafer polishing
- Patent number D839224
- Issue date Jan 29, 2019
- Ebara Corporation
- Satoru Yamaki
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Substrate holding apparatus and polishing apparatus
- Patent number 9,550,271
- Issue date Jan 24, 2017
- Ebara Corporation
- Hozumi Yasuda
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE HOLDING APPARATUS, ELASTIC MEMBRANE, POLISHING APPARATUS,...
- Publication number 20220048157
- Publication date Feb 17, 2022
- EBARA CORPORATION
- Osamu NABEYA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HOLDING APPARATUS, ELASTIC MEMBRANE, POLISHING APPARATUS,...
- Publication number 20180117730
- Publication date May 3, 2018
- EBARA CORPORATION
- Osamu NABEYA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS
- Publication number 20150202733
- Publication date Jul 23, 2015
- EBARA CORPORATION
- Hozumi YASUDA
- H01 - BASIC ELECTRIC ELEMENTS