Minsu JEONG

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Daejeon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive composition for semiconductor circuit connection, adhesive...
- Patent number 12,286,564
- Issue date Apr 29, 2025
- LG Chem, Ltd.
- Youngsam Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition for semiconductor circuit connection and adhes...
- Patent number 11,993,731
- Issue date May 28, 2024
- LG Chem, Ltd.
- Junghak Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Epoxy resin composition for molding semiconductor, molding film and...
- Patent number 11,702,520
- Issue date Jul 18, 2023
- LG Chem, Ltd.
- Minsu Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package
- Patent number 11,527,503
- Issue date Dec 13, 2022
- LG Chem, Ltd.
- You Jin Kyung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EPOXY RESIN COMPOSITION FOR MOLDING SEMICONDUCTOR, MOLDING FILM AND...
- Publication number 20230295388
- Publication date Sep 21, 2023
- LG CHEM, LTD.
- Minsu JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20210313290
- Publication date Oct 7, 2021
- LG CHEM, LTD.
- You Jin KYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION AND ADHES...
- Publication number 20210292616
- Publication date Sep 23, 2021
- LG CHEM, LTD.
- Junghak KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION, ADHESIVE...
- Publication number 20210292618
- Publication date Sep 23, 2021
- LG CHEM, LTD.
- Youngsam KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INSULATING LAYER FOR SEMICONDUCTOR PACKAGE...
- Publication number 20200395288
- Publication date Dec 17, 2020
- LG CHEM, LTD.
- Minsu JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR MOLDING SEMICONDUCTOR, MOLDING FILM AND...
- Publication number 20200347194
- Publication date Nov 5, 2020
- LG CHEM, LTD.
- Minsu JEONG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...