Mitsuru Komiyama

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package type semiconductor device
- Patent number 8,053,278
- Issue date Nov 8, 2011
- Oki Semiconductor Co., Ltd.
- Mitsuru Komiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package type semiconductor device
- Patent number 7,115,977
- Issue date Oct 3, 2006
- Oki Electric Industry Co., Ltd.
- Mitsuru Komiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package type semiconductor device
- Patent number 6,882,056
- Issue date Apr 19, 2005
- Oki Electric Industry Co., Ltd.
- Mitsuru Komiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding capillary and semiconductor device
- Patent number 6,457,627
- Issue date Oct 1, 2002
- Oki Electric Industry Co., Ltd.
- Mitsuru Komiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro ball grid array semiconductor device and semiconductor module
- Patent number 6,329,708
- Issue date Dec 11, 2001
- Oki Electric Industry Co. Ltd.
- Mitsuru Komiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-chip package type semiconductor device
- Publication number 20070048903
- Publication date Mar 1, 2007
- Oki Electric Industry, Co., Ltd.
- Mitsuru Komiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package type semiconductor device
- Publication number 20020153615
- Publication date Oct 24, 2002
- Mitsuru Komiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package type semiconductor device
- Publication number 20020047213
- Publication date Apr 25, 2002
- Mitsuru Komiyama
- H01 - BASIC ELECTRIC ELEMENTS