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Motoki Wakano
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Yasugi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Metal particle and method for producing the same, covered metal par...
Patent number
10,384,314
Issue date
Aug 20, 2019
Hitachi Metals, Ltd.
Motoki Wakano
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Semiconductor device including arrangement to control connection he...
Patent number
8,368,195
Issue date
Feb 5, 2013
Hitachi Metals, Ltd.
Hisashi Tanie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
8,053,908
Issue date
Nov 8, 2011
Hitachi Metals, Ltd.
Hisashi Tanie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder alloy and glass bonded body using the same
Patent number
7,901,782
Issue date
Mar 8, 2011
Hitachi Metals, Ltd.
Nobuhiko Chiwata
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Patents Applications
last 30 patents
Information
Patent Application
METAL PARTICLE AND METHOD FOR PRODUCING THE SAME, COVERED METAL PAR...
Publication number
20180056451
Publication date
Mar 1, 2018
Hitachi Metals, Ltd.
Motoki WAKANO
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20100193936
Publication date
Aug 5, 2010
HITACHI METALS, LTD
Hisashi Tanie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20100171209
Publication date
Jul 8, 2010
HITACHI METALS, LTD
Hisashi Tanie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER ALLOY AND GLASS BONDED BODY USING THE SAME
Publication number
20080241552
Publication date
Oct 2, 2008
Hitachi Metals, Ltd.
Nobuhiko CHIWATA
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...