Naohiro Hirose

Person

Ibi-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board with crossing wiring pattern
- Patent number 8,629,550
- Issue date Jan 14, 2014
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive pin attached to package substrate
- Patent number 8,536,696
- Issue date Sep 17, 2013
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and manufacturing method thereof
- Patent number 8,148,643
- Issue date Apr 3, 2012
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate with a conductive connecting pin
- Patent number 8,110,917
- Issue date Feb 7, 2012
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical transmission structural body, optical waveguide, optical wa...
- Patent number 8,078,024
- Issue date Dec 13, 2011
- Ibiden Co., Ltd.
- Naohiro Hirose
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Printed wiring board and its manufacturing method
- Patent number 8,065,794
- Issue date Nov 29, 2011
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive connecting pin for package substance
- Patent number 8,035,214
- Issue date Oct 11, 2011
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with notched conductive traces
- Patent number 8,018,046
- Issue date Sep 13, 2011
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical transmission structural body, optical waveguide, optical wa...
- Patent number 7,933,480
- Issue date Apr 26, 2011
- Ibiden Co., Ltd.
- Naohiro Hirose
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Conductive connecting pin and package substrate
- Patent number 7,902,659
- Issue date Mar 8, 2011
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connecting pins for a package substrate
- Patent number 7,847,393
- Issue date Dec 7, 2010
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer build-up wiring board including a chip mount region
- Patent number 7,847,318
- Issue date Dec 7, 2010
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multilayered printed circuit board
- Patent number 7,832,098
- Issue date Nov 16, 2010
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating process of electroplating an elecrically conductive...
- Patent number 7,827,680
- Issue date Nov 9, 2010
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for producing multi-layer printed wiring board
- Patent number 7,761,984
- Issue date Jul 27, 2010
- Ibiden Co., Ltd.
- Yasuji Hiramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and its manufacturing method
- Patent number 7,691,189
- Issue date Apr 6, 2010
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Optical transmission structural body, optical waveguide, optical wa...
- Patent number 7,574,085
- Issue date Aug 11, 2009
- Ibiden Co., Ltd.
- Naohiro Hirose
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Printed wiring board with wiring pattern having narrow width portion
- Patent number 7,525,190
- Issue date Apr 28, 2009
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer build-up wiring board
- Patent number 7,514,779
- Issue date Apr 7, 2009
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayered circuit board
- Patent number 7,415,761
- Issue date Aug 26, 2008
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical transmission structural body, optical waveguide, optical wa...
- Patent number 7,418,174
- Issue date Aug 26, 2008
- Ibiden Co., Ltd.
- Naohiro Hirose
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Multi-layer printed wiring board including an alignment mark as an...
- Patent number 7,375,289
- Issue date May 20, 2008
- Ibiden Co., Ltd.
- Yasuji Hiramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating crossing wiring pattern on a printed circuit...
- Patent number 7,332,816
- Issue date Feb 19, 2008
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and its manufacturing method
- Patent number 7,230,188
- Issue date Jun 12, 2007
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for producing a multi-layer printed wiring board
- Patent number 7,127,812
- Issue date Oct 31, 2006
- Ibiden Co., Ltd.
- Yasuji Hiramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer build-up wiring board
- Patent number 6,613,986
- Issue date Sep 2, 2003
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer printed wiring board
- Patent number 6,609,297
- Issue date Aug 26, 2003
- Ibiden Co., Ltd.
- Yasuji Hiramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of a multilayered printed circuit board having...
- Patent number 6,591,495
- Issue date Jul 15, 2003
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of production thereof
- Patent number 6,407,345
- Issue date Jun 18, 2002
- Ibiden Co., Ltd.
- Naohiro Hirose
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120125680
- Publication date May 24, 2012
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
- Publication number 20110290544
- Publication date Dec 1, 2011
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20100032200
- Publication date Feb 11, 2010
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20090314537
- Publication date Dec 24, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL TRANSMISSION STRUCTURAL BODY, OPTICAL WAVEGUIDE, OPTICAL W...
- Publication number 20090285531
- Publication date Nov 19, 2009
- IBIDEN, CO., LTD.
- Naohiro Hirose
- G02 - OPTICS
Information Patent Application
MULTILAYER BUILD-UP WIRING BOARD
- Publication number 20090173523
- Publication date Jul 9, 2009
- IBIDEN CO., LTD.
- Naohiro HIROSE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
- Publication number 20090159327
- Publication date Jun 25, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20090154131
- Publication date Jun 18, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
- Publication number 20090145652
- Publication date Jun 11, 2009
- IBIDEN CO., LTD.
- Honchin En
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20090053459
- Publication date Feb 26, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED WIRING BOARD INCLUDING AN ALIGHMENT MARK AS AN...
- Publication number 20090025216
- Publication date Jan 29, 2009
- IBIDEN CO., LTD.
- Yasuji Hiramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20080189943
- Publication date Aug 14, 2008
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20080173473
- Publication date Jul 24, 2008
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL TRANSMISSION STRUCTURAL BODY, OPTICAL WAVEGUIDE, OPTICAL WA...
- Publication number 20070269164
- Publication date Nov 22, 2007
- IBIDEN, CO., LTD.
- Naohiro Hirose
- G02 - OPTICS
Information Patent Application
OPTICAL TRANSMISSION STRUCTURAL BODY, OPTICAL WAVEGUIDE, OPTICAL WA...
- Publication number 20070269165
- Publication date Nov 22, 2007
- IBIDEN, CO., LTD.
- Naohiro Hirose
- G02 - OPTICS
Information Patent Application
PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
- Publication number 20070266886
- Publication date Nov 22, 2007
- IBIDEN CO., LTD.
- Honchin En
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for producing a multi-layer printed wiring board
- Publication number 20060131071
- Publication date Jun 22, 2006
- IBIDEN CO., LTD.
- Yasuji Hiramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and manufacturing method of printed wiring board
- Publication number 20050158553
- Publication date Jul 21, 2005
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical transmission structural body, optical waveguide, optical wa...
- Publication number 20050117845
- Publication date Jun 2, 2005
- IBIDEN, CO., LTD.
- Naohiro Hirose
- G02 - OPTICS
Information Patent Application
Printed wiring board and its manufacturing method
- Publication number 20040134682
- Publication date Jul 15, 2004
- IBIDEN CO., LTD.
- Honchin En
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Multilayered printed circuit board and manufacturing method therefor
- Publication number 20040025333
- Publication date Feb 12, 2004
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for producing a multi-layer printed wiring board
- Publication number 20030192182
- Publication date Oct 16, 2003
- IBIDEN CO., LTD.
- Yasuji Hiramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer build-up wiring board
- Publication number 20030102151
- Publication date Jun 5, 2003
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and manufacturing method of printed wiring board
- Publication number 20020189849
- Publication date Dec 19, 2002
- IBIDEN CO., LTD.
- Naohiro Hirose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayered printed circuit board and manufacturing method therefor
- Publication number 20010042637
- Publication date Nov 22, 2001
- Naohiro Hirose
- H01 - BASIC ELECTRIC ELEMENTS

Naohiro Hirose

Person

Patents Grantslast 30 patents

Printed wiring board with crossing wiring pattern

Conductive pin attached to package substrate

Multilayered printed circuit board and manufacturing method thereof

Package substrate with a conductive connecting pin

Optical transmission structural body, optical waveguide, optical wa...

Printed wiring board and its manufacturing method

Conductive connecting pin for package substance

Printed wiring board with notched conductive traces

Optical transmission structural body, optical waveguide, optical wa...

Conductive connecting pin and package substrate

Conductive connecting pins for a package substrate

Multilayer build-up wiring board including a chip mount region

Method of manufacturing a multilayered printed circuit board

Electroplating process of electroplating an elecrically conductive...

Process for producing multi-layer printed wiring board

Printed wiring board and its manufacturing method

Optical transmission structural body, optical waveguide, optical wa...

Printed wiring board with wiring pattern having narrow width portion

Multilayer build-up wiring board

Method of manufacturing multilayered circuit board

Optical transmission structural body, optical waveguide, optical wa...

Multi-layer printed wiring board including an alignment mark as an...

Method of fabricating crossing wiring pattern on a printed circuit...

Printed wiring board and its manufacturing method

Process for producing a multi-layer printed wiring board

Multilayer build-up wiring board

Method of manufacturing multilayer printed wiring board

Manufacturing method of a multilayered printed circuit board having...

Printed circuit board and method of production thereof

Patents Applicationslast 30 patents

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD

CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE

CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE

OPTICAL TRANSMISSION STRUCTURAL BODY, OPTICAL WAVEGUIDE, OPTICAL W...

MULTILAYER BUILD-UP WIRING BOARD

PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD

CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE

PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD

CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE

MULTI-LAYER PRINTED WIRING BOARD INCLUDING AN ALIGHMENT MARK AS AN...

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

OPTICAL TRANSMISSION STRUCTURAL BODY, OPTICAL WAVEGUIDE, OPTICAL WA...

OPTICAL TRANSMISSION STRUCTURAL BODY, OPTICAL WAVEGUIDE, OPTICAL WA...

PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD

Process for producing a multi-layer printed wiring board

Printed wiring board and manufacturing method of printed wiring board

Optical transmission structural body, optical waveguide, optical wa...

Printed wiring board and its manufacturing method

Multilayered printed circuit board and manufacturing method therefor

Process for producing a multi-layer printed wiring board

Multilayer build-up wiring board

Printed wiring board and manufacturing method of printed wiring board

Multilayered printed circuit board and manufacturing method therefor