Navas Khan Oratti Kalandar

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and methods for multi-die packaging
- Patent number 10,211,184
- Issue date Feb 19, 2019
- NXP USA, INC.
- Nishant Lakhera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate interconnections for packaged semiconductor device
- Patent number 9,997,445
- Issue date Jun 12, 2018
- NXP USA, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having two substrates
- Patent number 9,721,928
- Issue date Aug 1, 2017
- NXP USA, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with organic interposer
- Patent number 9,401,345
- Issue date Jul 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die ball grid array package
- Patent number 9,299,675
- Issue date Mar 29, 2016
- Freescale Semiconductor,INC
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE INTERCONNECTIONS FOR PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20180114748
- Publication date Apr 26, 2018
- NXP USA, Inc.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MULTI-DIE PACKAGING
- Publication number 20180053749
- Publication date Feb 22, 2018
- NXP USA, Inc.
- Nishant LAKHERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH POWER PLATES
- Publication number 20160163671
- Publication date Jun 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- SHAILESH KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE THROUGH SILICON VIA CONNECTION
- Publication number 20160086880
- Publication date Mar 24, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ORGANIC INTERPOSER
- Publication number 20160064356
- Publication date Mar 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY PACKAGE WITH MORE SIGNAL ROUTING STRUCTURES
- Publication number 20160056094
- Publication date Feb 25, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V.C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE BALL GRID ARRAY PACKAGE
- Publication number 20150243621
- Publication date Aug 27, 2015
- NAVAS KHAN ORATTI KALANDAR
- H01 - BASIC ELECTRIC ELEMENTS

Navas Khan Oratti Kalandar

Person

Patents Grantslast 30 patents

Apparatus and methods for multi-die packaging

Substrate interconnections for packaged semiconductor device

Integrated circuit package having two substrates

Semiconductor device package with organic interposer

Embedded die ball grid array package

Patents Applicationslast 30 patents

SUBSTRATE INTERCONNECTIONS FOR PACKAGED SEMICONDUCTOR DEVICE

APPARATUS AND METHODS FOR MULTI-DIE PACKAGING

INTEGRATED CIRCUIT PACKAGE WITH POWER PLATES

COPPER WIRE THROUGH SILICON VIA CONNECTION

SEMICONDUCTOR DEVICE PACKAGE WITH ORGANIC INTERPOSER

BALL GRID ARRAY PACKAGE WITH MORE SIGNAL ROUTING STRUCTURES

EMBEDDED DIE BALL GRID ARRAY PACKAGE