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Norihito Masuda
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Tokyo, JP
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last 30 patents
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Patent Grant
Structure and method of making interconnect element, and multilayer...
Patent number
8,859,420
Issue date
Oct 14, 2014
Invensas Corporation
Kimitaka Endo
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Structure and method of making interconnect element, and multilayer...
Patent number
7,923,828
Issue date
Apr 12, 2011
Tessera Interconnect Materials, Inc.
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
STRUCTURE AND METHOD OF MAKING INTERCONNECT ELEMENT, AND MULTILAYER...
Publication number
20110252637
Publication date
Oct 20, 2011
Tessera Interconnect Materials, Inc.
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Structure and method of making interconnect element, and multilayer...
Publication number
20060079127
Publication date
Apr 13, 2006
Socketstrate, Inc.
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR