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Osamu MATSUZAKI

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Patents Grantslast 30 patents

  • Information Patent Grant

    Electronic module
    • Patent number 11,658,109
    • Issue date May 23, 2023
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic module, method of manufacturing connector, and method of...
    • Patent number 11,437,340
    • Issue date Sep 6, 2022
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic module and method for manufacturing electronic module
    • Patent number 11,437,298
    • Issue date Sep 6, 2022
    • Shindengen Electric Manufacturing Co., Ltd.
    • Osamu Matsuzaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic module
    • Patent number 11,309,273
    • Issue date Apr 19, 2022
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic module
    • Patent number 11,276,663
    • Issue date Mar 15, 2022
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of manufacturing chip module
    • Patent number 11,264,351
    • Issue date Mar 1, 2022
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic module
    • Patent number 11,189,591
    • Issue date Nov 30, 2021
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic module, lead frame and manufacturing method for electron...
    • Patent number 11,037,870
    • Issue date Jun 15, 2021
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic module
    • Patent number 10,510,636
    • Issue date Dec 17, 2019
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Heat dissipating structure
    • Patent number 10,251,256
    • Issue date Apr 2, 2019
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Heat dissipating structure
    • Patent number 10,159,166
    • Issue date Dec 18, 2018
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Semiconductor module
    • Patent number 9,704,828
    • Issue date Jul 11, 2017
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRONIC MODULE
    • Publication number 20210210422
    • Publication date Jul 8, 2021
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Kosuke IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC MODULE
    • Publication number 20210202369
    • Publication date Jul 1, 2021
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Kosuke IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC MODULE
    • Publication number 20210183807
    • Publication date Jun 17, 2021
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Kosuke IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC MODULE
    • Publication number 20210175198
    • Publication date Jun 10, 2021
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Kosuke IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING CHIP MODULE
    • Publication number 20210175197
    • Publication date Jun 10, 2021
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Kosuke IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC MODULE, LEAD FRAME AND MANUFACTURING METHOD FOR ELECTRON...
    • Publication number 20210043554
    • Publication date Feb 11, 2021
    • Kosuke IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC MODULE, METHOD OF MANUFACTURING CONNECTOR, AND METHOD OF...
    • Publication number 20200273833
    • Publication date Aug 27, 2020
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Kosuke IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC MODULE
    • Publication number 20200161270
    • Publication date May 21, 2020
    • SHNDENGEN ELECTRIC MA
    • Kosuke IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC MODULE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE
    • Publication number 20190371703
    • Publication date Dec 5, 2019
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Osamu MATSUZAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HEAT DISSIPATING STRUCTURE
    • Publication number 20170311482
    • Publication date Oct 26, 2017
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Kosuke IKEDA
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    HEAT DISSIPATING STRUCTURE
    • Publication number 20170303385
    • Publication date Oct 19, 2017
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Kosuke Ikeda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20160254250
    • Publication date Sep 1, 2016
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Kosuke IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS