Rainer Tilgner

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Muenchen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for detecting a crack in a semiconductor wafer...
- Patent number 7,973,547
- Issue date Jul 5, 2011
- Infineon Technologies AG
- Alois Nitsch
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus for Detecting a Crack in a Semiconductor Wafer...
- Publication number 20100039128
- Publication date Feb 18, 2010
- Alois Nitsch
- G01 - MEASURING TESTING