Roger J. Stierman

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fixture and method for uniform electroless metal deposition on inte...
- Patent number 7,071,013
- Issue date Jul 4, 2006
- Texas Instruments Incorporated
- Gonzalo Amador
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reworking metal layers on integrated circuit bond pads
- Patent number 6,821,791
- Issue date Nov 23, 2004
- Texas Instruments Incorporated
- Roger J. Stierman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reworking metal layers on integrated circuit bond pads
- Patent number 6,534,327
- Issue date Mar 18, 2003
- Texas Instruments Incorporated
- Roger J. Stierman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture and a method for plating contact bumps for integrated circuits
- Patent number 5,024,746
- Issue date Jun 18, 1991
- Texas Instruments Incorporated
- Roger J. Stierman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Insulated substrate for flip-chip integrated circuit device
- Patent number 4,979,015
- Issue date Dec 18, 1990
- Texas Instruments Incorporated
- Roger J. Stierman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture and a method for plating contact bumps for integrated circuits
- Patent number 4,931,149
- Issue date Jun 5, 1990
- Texas Instruments Incorporated
- Roger J. Stierman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Fixture for plating tall contact bumps on integrated circuit
- Patent number 4,874,476
- Issue date Oct 17, 1989
- Texas Instruments Incorporated
- Roger J. Stierman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Fixture for plating tall contact bumps on integrated circuit
- Patent number 4,861,452
- Issue date Aug 29, 1989
- Texas Instruments Incorporated
- Roger J. Stierman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Coatings for ceramic bonding capillaries
- Patent number 4,691,854
- Issue date Sep 8, 1987
- Texas Instruments Incorporated
- James F. Haefling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Fixture and method for uniform electroless metal deposition on inte...
- Publication number 20050217574
- Publication date Oct 6, 2005
- Gonzalo Amador
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Fixture and method for uniform electroless metal deposition on inte...
- Publication number 20040118693
- Publication date Jun 24, 2004
- Gonzalo Amador
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for reworking metal layers on integrated circuit bond pads
- Publication number 20030153107
- Publication date Aug 14, 2003
- Roger J. Stierman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical device contact terminals free of particle generation
- Publication number 20030107137
- Publication date Jun 12, 2003
- Roger J. Stierman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and method for bond pads of copper-metallized integrated...
- Publication number 20030071319
- Publication date Apr 17, 2003
- Roger J. Stierman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fixture and method for uniform electroless metal deposition on inte...
- Publication number 20010047944
- Publication date Dec 6, 2001
- Gonzalo Amador
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for reworking metal layers on integrated circuit bond pads
- Publication number 20010046721
- Publication date Nov 29, 2001
- Roger J. Stierman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for bond pads of copper-metallized integrated...
- Publication number 20010033020
- Publication date Oct 25, 2001
- Roger J. Stierman
- H01 - BASIC ELECTRIC ELEMENTS

Roger J. Stierman

Person

Patents Grantslast 30 patents

Fixture and method for uniform electroless metal deposition on inte...

Method for reworking metal layers on integrated circuit bond pads

Method for reworking metal layers on integrated circuit bond pads

Fixture and a method for plating contact bumps for integrated circuits

Insulated substrate for flip-chip integrated circuit device

Fixture and a method for plating contact bumps for integrated circuits

Fixture for plating tall contact bumps on integrated circuit

Fixture for plating tall contact bumps on integrated circuit

Coatings for ceramic bonding capillaries

Patents Applicationslast 30 patents

Fixture and method for uniform electroless metal deposition on inte...

Fixture and method for uniform electroless metal deposition on inte...

Method for reworking metal layers on integrated circuit bond pads

Micromechanical device contact terminals free of particle generation

Structure and method for bond pads of copper-metallized integrated...

Fixture and method for uniform electroless metal deposition on inte...

Method for reworking metal layers on integrated circuit bond pads

Structure and method for bond pads of copper-metallized integrated...