Ronald J. Weachock

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Pottsville, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
Moisture barrier for a wire bond
- Patent number 9,136,245
- Issue date Sep 15, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture barrier for a wire bond
- Patent number 8,766,436
- Issue date Jul 1, 2014
- LSI Corporation
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including wire bonds
- Patent number 7,888,257
- Issue date Feb 15, 2011
- Agere Systems Inc.
- Joze Eura Antol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOISTURE BARRIER FOR A WIRE BOND
- Publication number 20140349475
- Publication date Nov 27, 2014
- LSI Corporation
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE BARRIER FOR A WIRE BOND
- Publication number 20120223432
- Publication date Sep 6, 2012
- LSI Corporation
- JOHN M. DELUCCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package including wire bonds
- Publication number 20090098687
- Publication date Apr 16, 2009
- Joze Eura Antol
- H01 - BASIC ELECTRIC ELEMENTS