Salman Akram

Person

Eindhoven, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Laser de-bond carrier wafer from device wafer
- Patent number 10,741,718
- Issue date Aug 11, 2020
- Lumileds, LLC
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching a light emitting device to a support substrate
- Patent number 9,705,047
- Issue date Jul 11, 2017
- Koninklijke Philips N.V.
- Daniel Alexander Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale light emitting device package with dome
- Patent number 9,660,154
- Issue date May 23, 2017
- Koninklijke Philips N.V.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching a light emitting device to a support substrate
- Patent number 9,431,581
- Issue date Aug 30, 2016
- Koninklijke Philips N.V.
- Daniel Alexander Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale light emitting device with metal pillars in a molding co...
- Patent number 9,406,857
- Issue date Aug 2, 2016
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding a semiconductor device to a support substrate
- Patent number 9,343,612
- Issue date May 17, 2016
- Koninklijke Philips N.V.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF ATTACHING A LIGHT EMITTING DEVICE TO A SUPPORT SUBSTRATE
- Publication number 20160197244
- Publication date Jul 7, 2016
- Koninklijke Philips N.V.
- Daniel Alexander Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE LIGHT EMITTING DEVICE PACKAGE WITH DOME
- Publication number 20160118554
- Publication date Apr 28, 2016
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATTACHING A LIGHT EMITTING DEVICE TO A SUPPORT SUBSTRATE
- Publication number 20160020198
- Publication date Jan 21, 2016
- Koninklijke Philips N.V.
- Daniel Alexander Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DE-BOND OF CARRIER WAFER FROM DEVICE WAFTER
- Publication number 20150228849
- Publication date Aug 13, 2015
- Koninklijke Philips N.V.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE LIGHT EMITTING DEVICE WITH METAL PILLARS IN A MOLDING CO...
- Publication number 20150144971
- Publication date May 28, 2015
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING A SEMICONDUCTOR DEVICE TO A SUPPORT SUBSTRATE
- Publication number 20140141552
- Publication date May 22, 2014
- Koninklijke Philips N.V.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE BONDED TO A SUPPORT SUBSTRATE
- Publication number 20140077246
- Publication date Mar 20, 2014
- Koninklijke Philips N.V.
- Jerome Chandra Bhat
- H01 - BASIC ELECTRIC ELEMENTS

Salman Akram

Person

Patents Grantslast 30 patents

Laser de-bond carrier wafer from device wafer

Method of attaching a light emitting device to a support substrate

Chip scale light emitting device package with dome

Method of attaching a light emitting device to a support substrate

Chip scale light emitting device with metal pillars in a molding co...

Method of bonding a semiconductor device to a support substrate

Patents Applicationslast 30 patents

METHOD OF ATTACHING A LIGHT EMITTING DEVICE TO A SUPPORT SUBSTRATE

CHIP SCALE LIGHT EMITTING DEVICE PACKAGE WITH DOME

METHOD OF ATTACHING A LIGHT EMITTING DEVICE TO A SUPPORT SUBSTRATE

LASER DE-BOND OF CARRIER WAFER FROM DEVICE WAFTER

CHIP SCALE LIGHT EMITTING DEVICE WITH METAL PILLARS IN A MOLDING CO...

METHOD OF BONDING A SEMICONDUCTOR DEVICE TO A SUPPORT SUBSTRATE

LIGHT EMITTING DEVICE BONDED TO A SUPPORT SUBSTRATE